| 标题 |
Advanced Measurement Method for Thermal Interface Material Thickness of Flip Chip Package |
| 网址 | |
| DOI | |
| 其它 |
期刊:2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 作者:Shih-Ping Chang; Liang-Pin Chen 出版日期:2021 |
| 求助人 | |
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(2025-6-4)