| 标题 |
High Heat Resistance and Low Dielectric o‐Cresol Formaldehyde Epoxy Resin Solder Resist Containing Photocurable Small Molecular Compound Based on 3,4‐Epoxycyclohexylmethyl Methacrylate |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of Applied Polymer Science 作者:Wei Tang; Keyu Lian; Jun-Hua Zhang 出版日期:2025-02-03 |
| 求助人 | |
| 下载 |
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(2025-6-4)