| 标题 |
Dual 3D network epoxy composites for 6G electronic packaging with superior terahertz absorption, through-plane thermal conductivity, and electrical insulation |
| 网址 | |
| DOI | |
| 其它 |
期刊:Chemical Engineering Journal 作者:Yunbo Guo; Noira R. Vokhidova; Yinxiang Lu 出版日期:2026-10-01 |
| 求助人 | |
| 下载 |
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(2025-6-4)