| 标题 |
Nondestructive Defect Detection in 3D X-ray Microscopy Data of Ball Grid Array Solder for Void Detection in Solder Joints using Deep Learning |
| 网址 | |
| DOI |
10.31399/asm.edfa.2024-3.p004
doi
|
| 其它 |
期刊:EDFA Technical Articles 作者:Kishansinh Rathod; Sankeerth Desapogu; Andreas Jansche; Timo Bernthaler; Gerhard Schneider; et al 出版日期:2024-09-10 |
| 求助人 | |
| 下载 | 暂无链接,等待应助者上传 |
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(2025-6-4)