| 标题 |
Managing 1000 W high-power chips by a High-Capacity and lightweight 3D thermosyphon: An experimental and theoretical study |
| 网址 | |
| DOI | |
| 其它 |
期刊:Applied Thermal Engineering 作者:Shichao Bu; Zhuye Jiang; Jie Li; Xiaoping Yang; Zhen Sun; et al 出版日期:2024-12-16 |
| 求助人 | |
| 下载 | 求助已完成,仅限求助人下载。 |
PDF的下载单位、IP信息已删除
(2025-6-4)