| 标题 |
Effective acquisition of elastoplastic and creep parameters of lead-free solder alloy from high-temperature micro-indentation eliminating the size effect |
| 网址 | |
| DOI | |
| 其它 |
期刊:Mechanics of Materials 作者:Gesheng Xiao; Yuhong Ma; Xinkuo Ji; Tiejun Wang; Xuefeng Shu; Erqiang Liu 出版日期:2021 |
| 求助人 | |
| 下载 |
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(2025-6-4)