| 标题 |
Study on Stress and Reliability of Advanced Intelligent Power Module (IPM) Subjected to Power Cycling |
| 网址 | |
| DOI | |
| 其它 |
期刊:2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) 作者:Fa Xing Che; Kazunori Yamamoto; Gong Yue Tang; Lin Ji 出版日期:2020-03-10 |
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(2025-6-4)