| 标题 |
Epoxy molding compound encapsulation process in IC packaging: a review at wafer and component levels |
| 网址 | |
| DOI | |
| 其它 |
期刊:The International Journal of Advanced Manufacturing Technology 作者:Ainnur Hanim Othman; Mohd Sharizal Abdul Aziz; Mohammad Hafifi Hafiz Ishak; Muhammad Naqib Nashrudin; Muhammad Aqil Azman 出版日期:2026-01-14 |
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(2025-6-4)