| 标题 |
A novel subsurface damage model in diamond wire sawing of silicon wafers |
| 网址 | |
| DOI | |
| 其它 |
期刊:Engineering Fracture Mechanics 作者:Huapan Xiao; Shenxin Yin; Chi Fai Cheung; Piao Zhou 出版日期:2024-10-05 |
| 求助人 | |
| 下载 |
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(2025-6-4)