| 标题 |
Interplay between morphology and thickness of a SiN interlayer for enhanced thermal transport across the GaN/diamond interface |
| 网址 | |
| DOI |
10.1103/htq6-6yp3
doi
|
| 其它 |
期刊:Physical review applied 作者:Anonymous; H. Chen; Shuang Tian; Yan Zhou; Lina Yang; et al 出版日期:2025-12-24 |
| 求助人 | |
| 下载 |
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(2025-6-4)