| 标题 |
Effects of wire type and mold compound on wearout reliability of semiconductor flash fineline BGA package |
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| DOI | |
| 其它 |
期刊:Impact 作者:C.L. Gan; C. Francis; B. L. Chan; E. Ng; U. Hashim 出版日期:2013-10-01 |
| 求助人 | |
| 下载 |
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(2025-6-4)