| 标题 |
Joining of Transparent Substrates Through a Combination of Laser-Induced Forward Transfer and Laser Micro-Welding |
| 网址 | |
| DOI |
10.1115/1.4072729
doi
|
| 其它 |
期刊:Journal of Micro and Nano Science and Engineering 作者:Santosh Kumar Sahoo; Vipul Kumar Sinha; Anurup Datta 出版日期:2026-10-09 |
| 求助人 | |
| 下载 |
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(2025-6-4)