| 标题 |
Flip-Chip Photonic-Electronic Integration Platform for Co-Packaged Optics Using a Glass Substrate With Vertically-Coupled Beam Expanding Lens
使用具有垂直耦合扩束透镜的玻璃基板的共封装光学器件的倒装芯片光子电子集成平台
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| 网址 |
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| DOI |
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| 其它 | Y. Mizuno, K. Kobayashi, S. Nakamura, M. Migita, H. Arao, T. Nakanishi, H. Uemura, K. Tanaka, K. Uesaka, M. Miyairi, Y. Ishizuki, and Y. Kurita, "Flip-Chip Photonic-Electronic Integration Platform for Co-Packaged Optics Using a Glass Substrate With Vertically-Coupled Beam Expanding Lens," in 2025 IEEE 75th Electronic Components and Technology Conference (ECTC). |
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(2025-6-4)
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