| 标题 |
Energy Analysis of Rear Door Heat Exchangers in Data Centers With Spatial Workload Distribution |
| 网址 | |
| DOI |
10.1115/ipack2023-112078
doi
|
| 其它 |
期刊:ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems 作者:V. Simon; S. Karajgikar; V. Mulay; S. Pundla; Krishna Bhavana Sivaraju; et al 出版日期:2023-10-24 |
| 求助人 | |
| 下载 |
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(2025-6-4)