| 标题 |
Application of non-woven aramid-polyimide composite materials for high reliability printed circuit boards for use in spacecraft electronics |
| 网址 | |
| DOI | |
| 其它 |
期刊:Materials Today: Proceedings 作者:B. Muthulakshmi; C. H. Rao; S. V. Sharma 出版日期:2021-01-01 |
| 求助人 | |
| 下载 |
PDF的下载单位、IP信息已删除
(2025-6-4)