| 标题 |
Full-field pump-probe thermoreflectance imaging for characterization of thin films and 3D integrated circuits |
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| DOI | |
| 其它 |
期刊:2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) 作者:Sami Alajlouni; Kerry Maize; Ali Shakouri 出版日期:2022-10-01 |
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(2025-6-4)