| 标题 |
A study on compatibility of thermal interface materials with coolants for data center immersion cooling |
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| DOI | |
| 其它 |
期刊:2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) 作者:Liu Yu; Jin Yang; David Shia; Ming Zhang 出版日期:2022 |
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(2025-6-4)