| 标题 |
A Back Illuminated 10μm SPAD Pixel Array Comprising Full Trench Isolation and Cu-Cu Bonding with Over 14% PDE at 940nm |
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| 其它 |
期刊:2020 IEEE International Electron Devices Meeting (IEDM) 作者:K. Ito; Y. Otake; Y. Kitano; A. Matsumoto; J. Yamamoto; et al 出版日期:2020-12-12 |
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(2025-6-4)