| 标题 |
Ag-coated Ni Metallization for Fluxless Indium-Based TIM Bonding |
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| DOI | |
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期刊:2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS) 作者:Y. H. Ku; C. Y. Yang; Y. H. Lu; C. R. Kao 出版日期:2026-04-14 |
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(2025-6-4)