| 标题 |
Microstructural evolution, residual stress, and mechanical property heterogeneity of high-aspect-ratio TGV copper interconnects fabricated by laser-assisted wet etching |
| 网址 | |
| DOI |
10.1016/j.jallcom.2026
doi
|
| 求助人 | |
| 下载 |
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(2025-6-4)