| 标题 |
Silicon photonics packaging for AI datacenters: technical challenges, reliability requirements and future directions – a critical review |
| 网址 | |
| DOI | |
| 其它 |
期刊:Microelectronics International 作者:Chong Leong Gan; Min-Hua Chung; C.I. Huang 出版日期:2026-04-06 |
| 求助人 | |
| 下载 |
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(2025-6-4)