| 标题 |
Enhancing Hygrothermal Aging Resistance and Interfacial Adhesion of Liquid Molding Compound/Silicon Systems via Chemical Modification |
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| DOI | |
| 其它 |
期刊:2026 27th International Conference on Electronic Packaging Technology (ICEPT) 作者:Shufang Zhang; Ting Xin; Yunfan Yin; Jie Pang; Kang Zhang; et al 出版日期:2026-08-01 |
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(2025-6-4)