| 标题 |
Interfacial microstructures and mechanical properties of Cu foam enhanced nano-Cu sintered joint for electronic packaging |
| 网址 | |
| DOI | |
| 其它 |
期刊:Materials Science in Semiconductor Processing 作者:Yue Wu; Hongze Lu; Haoye Sheng; Chenghao Zhang; Le Yang; et al 出版日期:2026-05-20 |
| 求助人 | |
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(2025-6-4)