| 标题 |
Heat transfer in a multi-layered semiconductor device with spatially-varying thermal contact resistance between layers |
| 网址 | |
| DOI | |
| 其它 |
期刊:International Communications in Heat and Mass Transfer 作者:Girish Krishnan; Ankur Jain 出版日期:2023 |
| 求助人 | |
| 下载 |
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(2025-6-4)