| 标题 |
Enhancement of electromigration lifetime of copper lines by eliminating nanoscale grains in highly -oriented nanotwinned structures |
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| DOI | |
| 其它 |
期刊:Journal of materials research and technology 作者:Dinh-Phuc Tran; Hung-Hsuan Li; I-Hsin Tseng; Chih Chen 出版日期:2021-11-01 |
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(2025-6-4)