| 标题 |
Multi-objective topology optimization of through-silicon-via (TSV)-embedded microchannel heat sinks for integrated chip thermal management |
| 网址 | |
| DOI | |
| 其它 |
期刊:International Journal of Thermal Sciences 作者:Yuanle Zhang; Yufan Gong; Qiang Li; Xuemei Chen 出版日期:2025-12-09 |
| 求助人 | |
| 下载 |
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(2025-6-4)