| 标题 |
3-D Multilayer Copper Interconnects for High-Performance Monolithic Devices and Passives |
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| DOI | |
| 其它 |
期刊:IEEE Transactions on Components, Packaging, and Manufacturing Technology 作者:A. Ghannam; D. Bourrier; Lamine Ourak; Christophe Viallon; Thierry Parra 出版日期:2013-05-03 |
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(2025-6-4)