| 标题 |
Investigations on deformation and fracture behaviors of the multi-alloyed SnAgCu solder and solder joint by in-situ observation |
| 网址 | |
| DOI | |
| 其它 |
期刊:Microelectronics Reliability 作者:Tangkui Zhu; Qingke Zhang; Hailong Bai; Lingyan Zhao; Jikang Yan 出版日期:2022-08-01 |
| 求助人 | |
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(2025-6-4)