| 标题 |
Optimal design of wafer back-grinding feeding profile considering subsurface damage and productivity |
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| DOI | |
| 其它 |
期刊:Microsystem Technologies-micro-and Nanosystems-information Storage and Processing Systems 作者:Byeong-Geon Kim; ByungHyun Hwang; Kyoung‐Su Park 出版日期:2024-04-22 |
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(2025-6-4)