Lv41
462 积分 2026-07-21 加入
Temporary Direct Bonding by Low Temperature Deposited SiO2 for Chiplet Applications
3小时前
已完结
Anisotropy of machined surfaces involved in the ultra-precision turning of single-crystal silicon—a simulation and experimental study
6天前
已完结
考虑弹塑性变形特征的单晶硅超精密磨削表面质量预测
1个月前
已完结
Modeling of the removal mechanism of monocrystalline silicon-based on phase change-dislocation theory and its edge chipping damage during micro-grinding
1个月前
已完结
Modelling and experimental validation of the multi-grit grinding process
1个月前
已完结
Modelling and experimental validation of the multi-grit grinding process
1个月前
已关闭
Material removal mechanism and corresponding models in the grinding
1个月前
已完结
皖公网安备34019202002308
