| 标题 |
Enhancement of the partial discharge inception voltage of ceramic substrates for power modules by trench coating |
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期刊:2016 International Conference on Electronics Packaging (ICEP) 作者:U. Waltrich; C. F. Bayer; M. Reger; A. Meyer; X. Tang; A. Schletz 出版日期:2016-06-10 |
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(2025-6-4)