| 标题 |
Efficient Thermal Design of Through-Silicon-Via (TSV) Based 3D Packaging for Scalable Quantum Computing Systems |
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| DOI | |
| 其它 |
期刊:2025 IEEE 27th Electronics Packaging Technology Conference (EPTC) 作者:Shubham Rathore; Mohit Kumar; Harsh Mishra; Satish Bonam; Pritam Xaxa; et al 出版日期:2025-12-02 |
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(2025-6-4)