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2.5D PIC Photonic Interposer Engine for Next Generation Photonic Link CPO of High-Performance Computing and Data Communications |
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期刊:2025 IEEE 27th Electronics Packaging Technology Conference (EPTC) 作者:Ting-Ta Chi; Feng Xu; Xiangyu Wang; Zhenyu Li; Wen Lee; Xiao Jun Yuan 出版日期:2025 |
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(2025-6-4)