| 标题 |
Mesoporous hollow silica with controlled particle size for optimizing dielectric properties and coefficient of thermal expansion of polyimide packaging materials |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of Materials Science & Technology 作者:Tianqi Hou; Xia Liu; Junwen Ren; Xianzhen Xu; Di Lan; et al 出版日期:2025-04-04 |
| 求助人 | |
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(2025-6-4)