| 标题 |
A Novel 600mm Panel Interposer with 300mm Panel Assembly Approach for Advanced Packaging Solution in HPC and AI Applications |
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期刊: 作者:Teck Chong Lee; Yungshun Chang; Ping-Feng Yang; Lihong Cao; Wiwy Wudjud; et al 出版日期:2026-05-26 |
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(2025-6-4)