| 标题 |
[高分]
The effect of electro-thermal fatigue on the structure of power electronic devices. Micro-structural evolution of the metallization layer |
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| DOI | |
| 其它 |
期刊:International Journal of Materials Research 作者:Benjamin Khong; M. Legros; P. Dupuy; C. Levade; G. Vanderschaeve 出版日期:2009-09-01 |
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(2025-6-4)