| 标题 |
Effect of the Soldering Atmosphere on the Wettability Between Sn4.0Ag0.5Cu (in wt.%) Lead-Free Solder Paste and Various Substrates |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of materials engineering and performance (Print) 作者:D. Soares; H. Leitão; C. Lau; J. C. Teixeira; L. Ribas; et al 出版日期:2018-05-29 |
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(2025-6-4)