| 标题 |
SiO2/SiC binary systems reinforced epoxy resins with high thermal conductivity and low CTE as underfill for 2.5D/3D electronic packaging |
| 网址 | |
| DOI | |
| 其它 |
期刊:Composites Communications 作者:Yinghuan Zhao; Xiaoxin Lu; Jingke Wang; Binbin Qi; Zhengxun Hu; et al 出版日期:2025-03-20 |
| 求助人 | |
| 下载 |
PDF的下载单位、IP信息已删除
(2025-6-4)