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TSV-less 3D stacking of MEMS and CMOS via low temperature Al-Au direct bonding with simultaneous formation of hermetic seal |
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期刊:2014 IEEE 64th Electronic Components and Technology Conference (ECTC) 作者:S. L. Chua; A. Razzaq; K. H. Wee; K. H. Li; H. Yu; et al 出版日期:2014-09-26 |
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(2025-6-4)