| 标题 |
Numerical simulation on controlling the front-side temperature of thinned SiC substrate during ohmic contact to Ni or Ti using back-side laser annealing |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of Applied Physics 作者:Jianwen Ding; Xin Li; Kaiming Yang; Yu Zhu 出版日期:2022-07-19 |
| 求助人 | |
| 下载 |
PDF的下载单位、IP信息已删除
(2025-6-4)