| 标题 |
Void-free filling of spin-on dielectric in 22nm wide ultrahigh aspect ratio Si trenches |
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| DOI | |
| 其它 |
期刊:Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena 作者:Krutarth Trivedi; Carlo Floresca; Sangjeoung Kim; Hyunjin Kim; Deogbae Kim; et al 出版日期:2009-11-01 |
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(2025-6-4)