| 标题 |
Finite element analysis of underfill effect on the CBGA package reliability under thermal cycling |
| 网址 | |
| DOI | |
| 其它 |
期刊:2022 23rd International Conference on Electronic Packaging Technology (ICEPT) 作者:Geng Li; Jiayun Feng; Taohan Wang; Zicheng Sa; Yanhong Tian 出版日期:2022-08-10 |
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(2025-6-4)