| 标题 |
[高分]
4D microwave photonic co-packaging and optical computing with the low-power ultra-high-speed millimeter wave optoelectronic CMOS technology |
| 网址 | |
| DOI |
10.1117/12.3073299
doi
|
| 其它 |
期刊:Optical Interconnects and Packaging 2026 作者:James N. Pan 出版日期:2026-03-04 |
| 求助人 | |
| 下载 | 求助已完成,仅限求助人或该文件上传人下载。 |
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(2025-6-4)