| 标题 |
In Situ Analysis of Copper Microstructures in Electromigration Using SEM-EBSD Techniques |
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| DOI | |
| 其它 |
期刊:2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 作者:Yaqian Zhang; Yixin Yan; Sten Vollebregt; Guoqi Zhang 出版日期:2024 |
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(2025-6-4)