| 标题 |
[高分]
Molecular Dynamics Study of the Interaction and Peeling Behaviorbetween Si Wafers and Pressure-sensitive Adhesive |
| 网址 | |
| DOI |
10.11618/adhesion.57.397
doi
|
| 其它 |
期刊: 作者: 出版日期: |
| 求助人 | |
| 下载 |
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(2025-6-4)