| 标题 |
Enabling Merged 3D NAND Memory Hole and Interlayer Dielectric (ILD) Contact Etches with Deposition and Etch Co-Optimization (DECO) |
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| DOI | |
| 其它 |
期刊: 作者:John Hoang; George Matamis; Calvin Pham; Hao Chi; Jonathan Church; et al 出版日期:2025-05-18 |
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(2025-6-4)