| 标题 |
Positive-type photosensitive polyimides for advanced microelectronic packaging: from molecular design to patterning and device reliability |
| 网址 | |
| DOI | |
| 其它 |
期刊:Chemical Engineering Journal 作者:Yao Wang; Zelin Han; Yushan Xu; Xiaodong Wang; Juan Yu; et al 出版日期:2026-11-01 |
| 求助人 | |
| 下载 |
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(2025-6-4)