| 标题 |
Fine-pitch bonding technology with surface-planarized solder micro-bump/polymer hybrid for 3D integration |
| 网址 | |
| DOI | |
| 其它 |
期刊:Japanese Journal of Applied Physics 作者:F. Inoue; J. Derakhshandeh; M. Lofrano; E. Beyne 出版日期:2021-01-21 |
| 求助人 | |
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(2025-6-4)