| 标题 |
Fabrication and mechanical behavior of (111) oriented nanotwinned Cu-bumps toward Cu-Cu bonding for 3D packaging |
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| DOI | |
| 其它 |
期刊:Materials & Design 作者:Huijun Cao; Yiwei Cui; Yuncong Wang; Qinghua Li; Yichen Zhu; et al 出版日期:2026-05-01 |
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(2025-6-4)