| 标题 |
Ultra-High Frequency Acoustic Micro-Imaging Simulation on Defect Detection at the TSV-Cu Bulk/Bonding Interface |
| 网址 | |
| DOI | |
| 其它 |
期刊:International Conference on Electronic Packaging Technology 作者:Zhiqiang Tian; Can Sheng; Heran Zhao; Ling Li; Binbin Xu; et al 出版日期:2024-08-07 |
| 求助人 | |
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(2025-6-4)